EFFITEST P900 Series

EFFITEST P900 Series

The Effitest P900 Series stands as an advanced high-speed testing system designed for the demanding production requirements of power discrete semiconductors. The Effitest P900 Series architecture shares the instruments of the Effitest platform with extension of high voltage, high current modules and additional extensions (UIL/UIS), Cg, Rg. Tailored for testing IGBTs, MOS-FETs, Power modules, Power Diodes, and other high-power semiconductors, the Effitest P900 Series showcases remarkable versatility. Notably, Effitest is test traditional Si semiconductors but also cutting-edge materials like SiC and GaN.


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Download detailed presentation here 


New Extensions available:


Available Configurations p900 series

  • Effitest p910 2500V / 10A
  • Effitest p911 800V / 100A
  • Effitest p912 800V / 300A
  • Effitest p913 2500V / 100A
  • Effitest p914 2500V / 300A
  • Effitest p915 2500V / 600A
  • Effitest p916 2500V / 900A
  • Effitest p917 2500V / 1200A
  • Effitest p918 2500V / 1500A

We can offer also individual configurations up to 2500V / 1500A!

Other special tests are RSurge, Thermal resistance, etc.

Multi-site testing capability

  • On wafer
  • On a handler
  • Ping-pong mode available (multiple sites with multiple different devices)

TESTING (Wafer, Bare Die, Packaged Componets):

  • Transistors (GaN, SiC, etc.)
  • MOS-FETs
  • IGBTs
  • MES-FETs
  • Diodes
  • Rectifiers
  • Bridges
  • SCRs
  • Hybrid modules
  • Power Devices
  • Power Transistors
  • Power Modules



  • Easy and fast menu-like TP programming
  • High speed test -  around 100 ms to test for high power MOS-FET, 50ms for a power diode
  • Throughput up to 45,000 UPH
  • Single, Dual or Quad Configuration
  • Virtual scope – internal instrument allowing display of measured parameters – voltages, currents, etc. with 100kHz sample rate
  • Automatic calibration / selftest
  • Configurable test head - scalable platform 
  • Wide library of standard test methods (following MIL-STD-750 and IEC 60747)
  • Wafer mapping

Technical specification

  • CVI unit  2×VI source 30V/3A, HV source 600V/10mA and Leakage current meter from 10nA range
  • High Current Source LVI 300A scalable up to 1500A
  • High Voltage Source HVI -2500V to +2500V 
  • Hi-current matrix MX1 with on board self-test
  • Digitizer & Time Measurement Unit with 100kHz for DC measurements, 500MHz for AC measurements
  • Resolution 16 bit force / measure


Areas of application

  • High volume production testing
  • Quality control
  • Failure analysis
  • Engineering testing



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